
We are on a quest to go beyond Moore’s law and keep scaling advanced semiconductor packaging technologies on a system level. ? Here's why: Miniaturization of electronic devices is a never ending process, to a large extent driven by the consumer demand for “smaller, faster and cheaper”. Semiconductor components are the “bricks” in these products and are continuously getting more competent. The development of semiconductor components has for many years followed a pace known as “Moore’s law”. However, Moore’s law will no longer be supported by today’s solutions and materials – the “red brick wall” is reached. Reducing the size of the transistors alone don’t do the trick anymore and the cost reduction in doing so is no longer a given fact. ? This is why advanced semiconductor packaging technologies are emerging to solve performance scaling on a system level instead. And this is why the need for new disruptive material is here. ? Our groundbreaking technology supports the semiconductor industry and the semiconductor packaging industry in meeting these new challenges. We facilitate the progress from pure planar 2D architecture to a much more compact and complex 2.5D and 3D architecture.
Smoltek is a global technology provider for the semiconductor industry in the new wave of advanced packaging and heterogeneous integration. By pioneering carbon nanotechnology we will keep scaling advanced semiconductor packaging technologies on a system level. And that will be the future of heterogeneous integration.
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Carbon Nanostructures

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