Bo Liu — GM of APAC and VP of Software & Applications Engineering at Sigma Designs

Mr. Bo Liu has been Vice President of Software & Applications Engineering at Sigma Designs, Inc. since March 1, 2016. Mr. Liu has been General Manager of APAC at Sigma Designs, Inc. since September 16, 2015 and served as its Vice President of Applications Engineering. Mr. Liu is responsible for directing all of Sigma's applications engineering and customer support operations for the APAC region. He served as the Vice President of Engineering for ICUBE and managed the ICUBE's entire engineering team including ASIC design, software development and applications engineering. He served as Vice President of Software and Applications for C2 Microsystems, Inc. Mr. Liu joined C2 Microsystems in July 2009 from Magnum Semiconductor. He served as the Vice President of Applications Engineering at Magnum Semiconductor Inc. Mr. Liu joined Magnum from Mediatek, where he served as its Vice President of China software engineering. Prior to Mediatek, Mr. Liu served as Vice President of software development for Tvia, Inc. While there, Mr. Liu was instrumental in developing Tvia's chip-related software and responsible for the initiation and implementation of the DVB, MPEG-4 and Home IT projects. His prior employment includes lead software engineering positions at Micronics Computers and Oak Technology. During his career, Mr. Liu has managed global multi-national organizations with over 300 engineers and supported tier 1 customers including Samsung, LG, Sony and Panasonic. He has more than 20 years of experience as an engineering executive in various capacities with a primary focus on software and applications. Mr. Liu earned a BSEE from Hefei Polytechnic University in Hefei, China and was awarded an MSEE from Wichita State University, Kansas. He was also a Ph.D. candidate at the University of Wisconsin ' Madison.