Chan Pin Chong — Senior Vice President of EA/APMR, Wedge Bonders, Capillaries & Blades Business Units at Kulicke and Soffa Industries

Mr. Chan Pin Chong has been Senior Vice President of EA/APMR, Wedge Bonders, Capillaries & Blades Business Units at Kulicke and Soffa Industries, Inc. since October 10, 2017. Mr. Chong served as Senior Vice President of AP-Hybrid, Electronics Assembly, Wedge Bonders, Capillaries & Blades Business Lines at Kulicke and Soffa Industries, Inc. since January 10, 2017. Mr. Chong served as Vice President of Electronics Assembly, Wedge Bonders, Capillaries & Blades Business Lines at Kulicke and Soffa Industries, Inc. from September 20, 2016 to January 10, 2017. Mr. Chong served as a Vice President of Wedge Bonder, Capillaries & Blades Business Lines at Kulicke and Soffa Industries, Inc. until September 20, 2016 and served as its Vice President of Wedge Bonder Business Unit since February 25, 2014. Mr. Chong has over 20 years of experience in the semiconductor and electronics industries, having held engineering and operations roles in his early career, spending the last 10 years in sales, business unit management and executive management roles. He started his career first as a Process and Test Engineer for Motorola, then Manufacturing Manager for Flextronics (NASDAQ: FLEX), followed by a long career at KLA-Tencor (NASDAQ: KLAC), holding such diverse positions as Sr. Technical Director and General Manager for a specific business unit. His most recent accomplishments were as Vice President of Sales and General Manager for Form Factor (NASDAQ: FORM) in Singapore and then as Global President & Chief Executive Officer at Everett Charles Technologies. Mr. Chong received bachelor's degrees in electrical engineering and computer science from the State University of New York at Buffalo and a master's degree in business administration from the University of Leicester, UK.